Plate heater for a manifold of an injection molding apparatus
US7806681B2 · kind B2 · utility
14Cited by
26References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Oct 2, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding apparatus includes a manifold having a manifold channel for receiving a melt stream of moldable material and delivering the melt stream to a mold cavity through a nozzle channel of a nozzle and a mold gate. A heater is coupled to the manifold. The heater includes a heater plate that is formed by an extrusion process and at least one channel for receiving a heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.