Copper-based alloy, and cast ingot and liquid-contacting part each using the alloy
US7806996B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | May 11, 2007 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Jul 31, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C9/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper-based alloy essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0<Se≦0.35 wt %, 0<P≦0.5, one of 0<Sb≦2.2 wt % and 0<Ni≦4.8 wt %, and a balance of Cu and unavoidable impurities. It may essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0≦Se≦0.35 wt %, 0<P<0.5 wt %, one of 0<Sb≦2.2 wt % and 0<Ni≦4.8 wt %, 1.20 to 4.90 Vol. % of at least one selected from the group consisting of a non-solid solution substance secured with Bi and a non-solid solution secured with Bi and Se, and a balance of Cu and unavoidable impurities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.