Method and system for pad conditioning in an ECMP process
US7807036B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2007 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Mar 17, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H5/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A conditioning disk, having a second electrode is placed on the polishing pad, such that the pad electrode and conditioning disk form an electrode pair. An electric potential is established between the conditioning disk and the pad electrode. This causes debris from the polishing pad to become ionized, and attracted to the conditioning disk. The conditioning disk is then removed from the eCMP tool, allowing the eCMP tool to resume operation on normal semiconductor wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.