Formulation and method for depositing a material on a substrate
US7807070B2 · kind B2 · utility
1Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2008 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Oct 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/917
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A formulation for depositing a material on a substrate, the formulation comprising the material to be deposited on the substrate dissolved in a solvent system comprising a first solvent component having a relatively high boiling point and which exhibits a relatively low solubility with respect to the material to be deposited, and a second solvent component having a relatively low boiling point and which exhibits a relatively high solubility with respect to the material to be deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.