Patent · US Active

Label for in-mold forming having excellent delabeling property, and container with the label

US7807243B2 · kind B2 · utility

4Cited by

4References

17Claims

0Family size

Assignee

YUPO CORPORATION · JP

Inventors

Yasuo Iwasa · Ibaraki, JP
Masaki Shiina · Maebashi, JP
Takatoshi Nishizawa · Kashima, JP

Key dates

Filing date	Sep 7, 2006
Grant date	Oct 5, 2010
Priority date	—
Expiry date	Jan 26, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31938
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The invention relates to: a label for in-mold forming having excellent suitability for delabeling which comprises a thermoplastic resin film base layer (I) and a heat-sealable resin layer (II) and in which the heat-sealable resin layer (II) has an adhesion strength as measured at 23° C. of 300 gf/15 mm or higher and an adhesion strength as measured at 90° C. of 290 gf/15 mm or lower; and a labeled resin container having the label bonded thereto.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.