Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof
US7808086B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 29, 2008 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Nov 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.