Probes for a wafer test apparatus
US7808260B2 · kind B2 · utility
2Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2006 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | May 12, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07357
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.