Multiple chip module cooling system and method of operation thereof
US7808783B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2008 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Sep 18, 2028 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2400/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.