Full perimeter chemical strengthening of substrates
US7810355B2 · kind B2 · utility
61Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2008 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Jun 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.