Patent · US Active

Multi-layer encapsulation of diamond grit for use in earth-boring bits

US7810588B2 · kind B2 · utility

20Cited by
13References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 23, 2007
Grant dateOct 12, 2010
Priority date
Expiry dateFeb 6, 2029

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB22F2998/00
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method of constructing an earth-boring, diamond-impregnated drill bit has a first step of coating diamond grit with tungsten to create tungsten-coated diamond particles. These coated particles are then encapsulated in a layer of carbide powder held by an organic green binder material. The encapsulated granules are then mixed along with a matrix material and placed in a mold. The matrix material includes a matrix binder and abrasive particles. The mixture is heated in the mold at atmospheric pressure to cause the matrix binder to melt and infiltrate the encapsulated granules and abrasive particles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.