Multi-layer encapsulation of diamond grit for use in earth-boring bits
US7810588B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2007 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Feb 6, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of constructing an earth-boring, diamond-impregnated drill bit has a first step of coating diamond grit with tungsten to create tungsten-coated diamond particles. These coated particles are then encapsulated in a layer of carbide powder held by an organic green binder material. The encapsulated granules are then mixed along with a matrix material and placed in a mold. The matrix material includes a matrix binder and abrasive particles. The mixture is heated in the mold at atmospheric pressure to cause the matrix binder to melt and infiltrate the encapsulated granules and abrasive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.