Board for inkjet printing head and inkjet printing head using the same
US7810907B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2006 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Jul 5, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14072
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a configuration for connecting common wires (a common power supply wire for connecting a plurality of printing elements commonly to a power supply and a common ground wire for connecting the plurality of printing elements commonly to a ground) to the outside, which configuration does not obstruct a constitution for reducing resistances of the common wires. For this purpose, the common wires are directly connected respectively to electrode leads of an electric wiring tape for external connection without use of electrode pads. In the case of this configuration, the widths of the common wires need not be narrower in vicinities of the electrode pads which would otherwise be in an edge of the board, and accordingly reduction of resistances of the common wires is not obstructed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.