Thermal inkjet printhead
US7810911B2 · kind B2 · utility
3Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2007 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Aug 11, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14072
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.