Light fixture assembly having improved heat dissipation capabilities
US7810960B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2008 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Jan 1, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the illumination assembly, wherein the cover structure, which has an enlarged surface area formed of a heat conductive material, defines a decorative exterior of the light fixture and is disposed exterior of a mounting surface, thereby effectively dissipating the heat generated by the LED illumination assembly towards the environment being illuminated by the light fixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.