Method for fabricating electronic and photonic devices on a semiconductor substrate

US7811844B2 · kind B2 · utility

Assignee

• BAE Systems Information and Electronic Systems Integration Inc. · US

Inventors

• Daniel N. Carothers · Oro Valley, US
• Craig M. Hill · Warrenton, US
• Andrew T. S. Pomerene · Leesburg, US
• Timothy J. Conway · Gainesville, US
• Rick Thompson · West Burlington, US
• Vu A. Vu · Falls Church, US
• Robert L. Kamocsai · Manassas, US
• Joe Giunta · Warrenton, US
• Jonathan N. Ishii · Fredericksburg, US

Key dates

• Filing date: Aug 29, 2008
• Grant date: Oct 12, 2010
• Expiry date: Aug 29, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/40

Abstract

A method for fabricating photonic and electronic devices on a substrate is disclosed. Multiple slabs are initially patterned and etched on a layer of a substrate. An electronic device is fabricated on a first one of the slabs and a photonic device is fabricated on a second one of the slabs, such that the electronic device and the photonic device are formed on the same layer of the substrate.