Method for manufacturing high efficiency light-emitting diodes
US7811845B2 · kind B2 · utility
5Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2006 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Jul 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
Abstract
A method for manufacturing a light-emitting device comprising the steps of cutting a light-emitting unit by a laser beam, and cleaning the light-emitting unit by an acid solution to remove by-products resulted from the laser cutting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.