Semiconductor device and method for manufacturing the same
US7811946B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2009 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Apr 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
The present invention provides a semiconductor device having a coating film of a predetermined thickness provided along the circumference of a semiconductor light emitting element, and provide a method for easily manufacturing the semiconductor device.A semiconductor light emitting element 2 that emits blue light is mounted face down on the top face of a pedestal 1, and a coating film 3 containing a YAG fluorescent material 6 that emits yellow light is placed so as to cover the top face and side face of the semiconductor light emitting element 2 and the top face of the pedestal 1. With the semiconductor light emitting element 2 and other elements placed between a first film 8 and a second film 9, the films are laminated in vacuum, thereby to fasten the coating film 3 onto the semiconductor light emitting element 2. Then the first film 8 and the second film 9 are removed, the coating film 3 is trimmed and the pedestal 1 is diced, thereby to obtain the semiconductor device 100 having the coating film 3 of a predetermined thickness provided along the circumference of the semiconductor light emitting element 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.