Method of polishing tape-shaped substrate and substrate for oxide superconductor
US7811972B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2008 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Aug 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/813
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A target surface of a tape-shaped substrate of an oxide superconductor with an intermediate layer formed on this target surface and an oxide superconductor thin film is polished by causing the tape-shaped substrate to continuously run. The polishing step includes an initial polishing process for carrying out random polishing of the target surface and a finishing process that is carried out after the initial polishing process for forming grooves on the target surface along the running direction of the substrate. The intermediate layer has an in-plane directionality of 7° or less. The tape-shaped substrate is fabricated by rolling nickel, a nickel alloys or stainless steel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.