Chip-scaled MEMS microphone package
US7812418B2 · kind B2 · utility
11Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2008 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Sep 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An MEMS microphone package includes a circuit board and an MEMS microphone chip. The MEMS microphone chip, mounted on the circuit board, includes a substrate, an MEMS transducer formed on the substrate, and a readout circuit also formed on the substrate. The MEMS transducer generates a sound signal according to sound pressure variations. The readout circuit reads the sound signal from the MEMS transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.