Method of making through-hole vias in a substrate
US7814652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2008 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Apr 24, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53052
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.