Airflow heat dissipation device
US7814965B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2006 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Aug 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Airflow-based heat dissipation is described. A heat sink includes a housing with a first chamber and a second chamber separated by an interface located below the first chamber. The first chamber has sidewalls with first side ports and an access opening. Pins extend from a top surface of the interface into the first chamber. The top surface of the interface has dimples located between the pins and first passageways which extend from the dimples of the top surface to a bottom surface of the interface. The second chamber has a network of tunnels with ends that extend to the sidewalls to provide second side ports. The first passageways extend to the network of tunnels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.