Three-dimensional plated support frame
US7815475B2 · kind B2 · utility
16Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2008 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Dec 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/931
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.