Method of manufacturing hermetically sealed container
US7815760B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2008 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Jan 8, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/42
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a hermetically sealed container including a pair of substrates disposed in opposition to each other, a frame member disposed between the pair of substrates, and a bonding member bonding the substrate to the frame member, includes a bonding step of heating the bonding member for bonding the substrate to the frame member. The bonding step includes a measuring process for measuring a height of the bonding member in a direction perpendicular to the substrate, and a heating and pressing process for partially pressing the substrate to the bonding member while partially heating the bonding member. The heating and pressing process is conducted by scanning, along the bonding member, an area of the bonding member partially heated and an area of the substrate partially pressed. During the heating and pressing process, the pressure exerted on the substrate is controlled based on the measured height of the bonding member measured such that a constant pressure is exerted between the substrate and the bonding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.