Modular mold system and related method
US7815840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2008 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Feb 4, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/1742
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A modular mold system includes a hot half and a cold half. The hot half has a heated distributor assembly to receive molding material from an injection molding machine. The distributor assembly has a forward side that is opposite a side of the distributor assembly that faces the injection molding machine. A plurality of heated multi-nozzle units may also be provided. Each multi-nozzle unit has a manifold and a plurality of forward-extending nozzles. Each multi-nozzle unit is individually forwardly removably fastened to the forward side of the distributor assembly and removable from the distributor assembly while the distributor assembly is fastened to the first platen. The cold half includes a mounting plate and a plurality of cold-side units associated with the multi-nozzle units. Each cold-side unit is removably fastened to the mounting plate and engagable with one of the multi-nozzle units to define the one or more mold cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.