Architecture for high temperature superconductor wire
US7816303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2005 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Jul 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/702
Abstract
A laminated superconductor wire includes a superconductor wire assembly, which includes a first superconductor insert comprising a first high temperature superconductor layer overlaying a first substrate and a second superconductor insert comprising a second high temperature superconductor layer overlaying a second substrate. The first and second superconductor inserts are joined together at their respective substrates. An electrically conductive structure substantially surrounds the superconductor wire assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.