Patent · US Active

Architecture for high temperature superconductor wire

US7816303B2 · kind B2 · utility

10Cited by
23References
37Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 29, 2005
Grant dateOct 19, 2010
Priority date
Expiry dateJul 29, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S505/702

Abstract

A laminated superconductor wire includes a superconductor wire assembly, which includes a first superconductor insert comprising a first high temperature superconductor layer overlaying a first substrate and a second superconductor insert comprising a second high temperature superconductor layer overlaying a second substrate. The first and second superconductor inserts are joined together at their respective substrates. An electrically conductive structure substantially surrounds the superconductor wire assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.