Patent · US Active

Interface for a laser processing head

US7816621B2 · kind B2 · utility

1Cited by
9References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 31, 2005
Grant dateOct 19, 2010
Priority date
Expiry dateJul 20, 2029

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K37/0235
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A material processing machine configured to process a workpiece with a processing head movable with respect to the workpiece, including a workpiece support, a processing head carrier movable with respect to the workpiece support, the carrier including a first half of a releasable head coupling, and a processing head carried by the head carrier and positioned to operably engage a workpiece supported by the support to process the workpiece, the processing head including a second half of the releasable head coupling. The releasable head coupling defines an adjustable head release force.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.