Interface for a laser processing head
US7816621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2005 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Jul 20, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K37/0235
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A material processing machine configured to process a workpiece with a processing head movable with respect to the workpiece, including a workpiece support, a processing head carrier movable with respect to the workpiece support, the carrier including a first half of a releasable head coupling, and a processing head carried by the head carrier and positioned to operably engage a workpiece supported by the support to process the workpiece, the processing head including a second half of the releasable head coupling. The releasable head coupling defines an adjustable head release force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.