Patent · US Active

High temperature range electrical circuit testing

US7816930B2 · kind B2 · utility

0Cited by

7References

17Claims

0Family size

Assignee

ON Semiconductor · US

Inventors

Ronald W. Young · Stevenage, GB
Frank Deruyck · Nazareth, BE

Key dates

Filing date	Oct 12, 2007
Grant date	Oct 19, 2010
Priority date	—
Expiry date	Apr 11, 2028

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2874
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An electrical circuit testing assembly that includes a mechanical reference that is relatively stationary as compared to a circuit under test. A probe support assembly is coupled to the mechanical reference and includes probes for contacting interconnect pads on the circuit under test. Optionally, the probe support structure is attached to the mechanical reference via a column that is thermally resistive. Also optionally, a testing circuitry support structure (e.g., a printed circuit board) is not rigidly attached to the mechanical reference or to the probe support structure, thereby permitting the testing circuitry support structure to float with respect to the probe support structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.