Heat sink and cooling and packaging stack for press-packages

US7817422B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Satish Sivarama Gunturi · Albany, US
• Mahadevan Balasubramaniam · Ballston Lake, US
• Ramakrishna Venkata Mallina · Mason, US
• Richard Alfred Beaupre · Pittsfield, US
• Le Yan · Shanghai, CN
• Richard S. Zhang · Berkeley, US
• Ljubisa Dragoljub Stevanovic · Clifton Park, US
• Adam Gregory Pautsch · Madison, US
• Stephen Adam Solovitz · Ossining, US

Key dates

• Filing date: Aug 18, 2008
• Grant date: Oct 19, 2010
• Expiry date: Apr 28, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.