Manufacturing process or in service defects acoustic imaging using sensor array

US7817843B2 · kind B2 · utility

Assignee

• The Boeing Company · US

Inventors

• Simon D. Senibi · Covington, US
• David L. Banks · Simpsonville, US
• Chris K Carrell · Bothell, US
• Mark A. Curry · Lynnwood, US

Key dates

• Filing date: Mar 4, 2004
• Grant date: Oct 19, 2010
• Expiry date: Nov 5, 2026

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2291/106
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A mobile platform is provided which has at least one component having an array of distributed piezoelectric transmitters and an associated array of distributed receivers. The receivers are configured to receive ultrasonic transmissions from the transmitters. Data from the receivers is stored in memory and processed through an algebraic reconstruction tomography algorithm which forms an image of the defect within the component. An algorithm is used to determine the position and size of the defect.