Multi-chip systems using on-chip photonics
US7817880B1 · kind B1 · utility
21Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2007 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Apr 14, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/35
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of a system are described. This system includes an array of single-chip modules (CMs), which includes a first CM and a second CM which are coupled to each other. A given CM, which can be either the first CM or the second CM, includes a semiconductor die that is configured to communicate data signals with other CMs by capacitively coupled proximity communication and optical proximity communication using proximity connectors. These proximity connectors are proximate to a surface of the semiconductor die, and the semiconductor die includes an optical signal path configured to communicate on-chip optical signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.