Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto

US7819506B2 · kind B2 · utility

Assignee

• Lexmark International, Inc. · US

Inventors

• David C. Graham · Lexington, US
• Eric Spencer Hall · Lexington, US
• Gary Holt · Lexington, US
• Richard Leo Hubert, II · Lexington, US
• Johnny Dale Massie, II · Lexington, US
• Sean T. Weaver · Florence, US
• Jonathan Harold Laurer · Boone, US
• Rich Wells · Delaware, US

Key dates

• Filing date: Mar 13, 2007
• Grant date: Oct 26, 2010
• Expiry date: Dec 18, 2028

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B41J2/1603
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).