Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes
US7820051B2 · kind B2 · utility
2Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2007 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Feb 27, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method, process and system for the recycling of electrochemical-mechanical planarization slurries/electrolytes as they are used in the back end of line of the semiconductor wafer manufacturing process is disclosed. The method, process and system includes with the removal of metal ions from slurries using ion exchange media and/or electrochemical deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.