Encapsulated optical package
US7820462B2 · kind B2 · utility
1Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2004 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Apr 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.