Method for LTCC circuitry
US7820490B2 · kind B2 · utility
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3References
12Claims
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Key dates
| Filing date | Jun 12, 2006 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Sep 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.