Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus
US7821283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2006 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Mar 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein are a circuit board device for wafer inspection having high connection reliability, and a probe card and a wafer inspection apparatus, which are equipped with this circuit board device for wafer inspection. The circuit board device for wafer inspection has a board body and a connector device provided on the board body and obtained by stacking a plurality of connector units on each other, wherein each of the connector units has a first anisotropically conductive elastomer sheet, a composite conductive sheet, a second anisotropically conductive elastomer sheet and a pitch converting board, the composite conductive sheet has an insulating sheet, in which a plurality of through-holes have been formed, and rigid conductors respectively arranged into the through-holes in this insulating sheet so as to protrude from both surfaces of the insulating sheet, and in each of the rigid conductors, terminal portions having a diameter greater than the diameter of the through-hole are formed on both ends of a body portion inserted into the through-hole in the insulating sheet in order for the conductor to be provided movably in the thickness-wise direction of the insulating sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.