Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards
US7821790B2 · kind B2 · utility
40Cited by
56References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2007 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Nov 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular chassis arrangement for electronic modules that is configurable into a mechanically and electrically interconnected structure capable of delivering scalable mechanical, electrical and environmental functionality for a multiplicity of electronic modules. In one embodiment, the electronic modules are compliant with AdvancedTCA or MicroTCA standards in a modular Pico-Shelf configuration that support stackable and/or back-to-back multiple unit chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.