Housing for a power module
US7821791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2007 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Jan 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.