Scalable CPU (central processing unit) modules for enabling in-place upgrades of electronics systems
US7822895B1 · kind B1 · utility
5Cited by
0References
18Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Apr 20, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/4068
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Described is an electronics enclosure having a midplane, a first field-replaceable CPU (central processing unit) module, and a second field-replaceable CPU module. Each CPU module is independently pluggable into and removable from the midplane. Each CPU module is configurable into either one of a first configuration and a second configuration, wherein the CPU modules operate independently as separate CPU modules when configured according to the first configuration and cooperate as a unitary CPU module when configured according to the second configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.