Patent · US Active

Silicon chip having inclined contact pads and electronic module comprising such a chip

US7823322B2 · kind B2 · utility

1Cited by

7References

24Claims

0Family size

Assignee

STMicroelectronics SA

Inventors

Romain Palmade · Auriol, FR
Agnes Rogge · Gap, FR

Key dates

Filing date	Nov 9, 2007
Grant date	Nov 2, 2010
Priority date	—
Expiry date	Feb 3, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH10D62/117
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip has an active face in which an integrated circuit region is implanted. The chip includes an inclined lateral contact pad extending beneath the plane of the active face and electrically linked to the integrated circuit region. An electronic module includes a substrate having a cavity in which the chip is arranged. The module can be applied to the production of thin contactless micro-modules for smart cards and contactless electronic badges and tags.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.