Apparatus and method for selective processing of materials with radiant energy
US7823366B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2004 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Dec 28, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B9/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Apparatus selectively processes a substrate using radiant energy. The substrate can consist of any target material having a portion to be processed using the radiant energy and a larger portion to be unprocessed. The apparatus includes a source of radiant energy (preferably a quantum cascade laser) that has a customizable spectrum that can be configured to be specifically absorbed only by the portion to be processed, and a control system for targeting the radiant energy only at the portion to be processed. Specific examples of the use of the apparatus and method are in the technologies of heat-shrinking polyethylene film, fusing toner to paper in a laser printer, heating reaction vessels in DNA testing, and temperature profiling bottle pre-forms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.