Apparatus for etching substrate and method of fabricating thin-glass substrate
US7823595B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 2, 2007 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Nov 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate relative to the other in a predetermined direction in such a condition that the substrate and the nozzle system face each other, (c) a filter system which filters off particles out of the acid solution having been sprayed onto the substrate, and (d) a circulation system which circulates the acid solution having been sprayed onto the substrate, to the filter system, and further, to the nozzle system from the filter system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.