Injection molding system having a bus
US7824163B2 · kind B2 · utility
2Cited by
21References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2007 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Jul 23, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2751
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding system includes a mold having a hot half and a cold half, the hot half including a hot runner. A bus transceiver is located in the mold. At least one electrical device associated with the operation of the mold is located in the mold and electrically coupled to the bus transceiver. A controller for controlling the mold is located outside the mold. A bus line electrically couples the controller to the bus transceiver of the electrical device apparatus includes an injection manifold having an inlet and a melt channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.