Embossing method and apparatus
US7824516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2003 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Mar 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1737
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for forming a patterned layer having a surface profile that provides relief structures within an electronic device. The method comprises the steps of taking a carrier film (50) having an inverse of the required surface profile formed on one side thereof, taking a layer of fixable material (54) located on a substrate (52), laminating the carrier film (50) and substrate (52) such the carrier film causes the required surface profile to be formed in the layer of fixable material with a predetermined offset, and then fixing the fixable material. Lamination may be performed using rollers (56,58) or a vacuum process. The process is designed to ensure that the offset can be kept as low as possible, preferably to within 150 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.