Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head
US7824560B2 · kind B2 · utility
4Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2007 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Oct 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.