Bond line forming method
US7824592B2 · kind B2 · utility
3Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2006 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Aug 19, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for forming a bond between a first and a second shell of a blade is provided. The method comprises the steps of forming a cavity between said first and second blade shells and filling an adhesive into said cavity to form a bond line between said first and second blade shells.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.