Integrated circuit comprising an amorphous region and method of manufacturing an integrated circuit
US7825013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2008 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Dec 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit comprises a doped semiconductor portion including an amorphous portion and a contact structure comprising a conductive material. The contact structure is in contact with the amorphous portion. According to another embodiment, an integrated circuit comprises a doped semiconductor portion including a region having a non-stoichiometric composition and a contact structure comprising a conductive material. The contact structure is in contact with the region having a non-stoichiometric composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.