Laser processing method and laser processing apparatus
US7825350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Aug 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0341
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.