Micromechanical device for infrared sensing
US7825381B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2008 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Jan 24, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/40
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical device including an improved sensing element and improved bending elements is described. Sensing elements include multi-layered structures which are thinner, lighter, and flatter than structures presently known within the related arts. Bending elements include structures which separately respond to illumination by an infrared source so as to twist a sensing element. Micromechanical pixels may be arranged to form two-dimensional arrays of infrared sensitive pixels. Arrays of micromechanical pixels are applicable to imaging devices for use within the fields of security and surveillance, firefighting, automotive safety, and industrial monitoring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.