Interconnect architecture for disc drive array
US7826171B2 · kind B2 · utility
3Cited by
20References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2007 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Sep 3, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In general, the invention is directed to techniques for integrated interconnects with a set of disc drives. The interconnects allow for a set of disc drives to be positioned in an array; for example, as set of disc drives may be stacked to communicate with a device through a single interface of the device. The interconnects may be formed as vias within the housing of the disc drives. Vias may produced using MEMS techniques, e.g., electroplating, as part of the manufacturing processes of the disc drive itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.