Thermal control through a channel structure
US7826212B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2006 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Jun 30, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/1426
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Thermal control through a channel structure is disclosed. In one embodiment, an apparatus includes devices operable at an undesired temperature relative to a desired operating temperature, a vented cover of each of devices, and a channel structure formed along a side face of each of the devices, the channel structure having any number of ridges to transfer a gas between the vented cover and an external location to the apparatus. The gas may modify an operating state of the devices from the undesired temperature to the desired operating temperature. A heat structure coupled to the vented cover and the side face may absorb a portion of an energy dissipated by at least one of the devices. A printed circuit board may be formed along an opposite face relative to the vented cover to enable the gas to escape to the external location through a cavity of the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.