Component retention with distributed compression
US7826229B2 · kind B2 · utility
10Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2006 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | Sep 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.